IC Semiconductor Packaging Mold

IC Semiconductor Packaging Mold

1. IC Semiconductor Packaging Mold Introduction

IC Semiconductor Packaging Mold is made of integral cemented carbide material, which has the characteristics of high hardness and high bending strength. It is generally used for partial shape and diameter reduction of various hardware parts, and is stamped and formed by cemented carbide necking die at one time.

In order to reduce the cost of IC Semiconductor Packaging Mold, only the working part of the necking die is made of pure tungsten steel, and the mounting and clamping part of the die body is made of other steel materials, so that the cost performance of the necking die has been well improved and the value for money is truly achieved. Quality assurance is the principle we always adhere to.

To provide customers with IC Semiconductor Packaging Mold, with the goal of exceeding customers' use requirements.

2.Feature And Application Of IC Semiconductor Packaging Mold

1. use high purity raw tungsten carbide powder with content of 99.95%.

2.IC Semiconductor Packaging Mold has high wear resistance and impact resistance.

3. Non-destructive ultrasonic testing, no sand holes, no air holes, high material density.

4.The professional material engineer shall select the material formula and select the superfine primary powder.  

5. Advanced precision machining equipment+unique technology enhances the stamping life of dies.  

6.IC Semiconductor Packaging Mold has High wear resistance and long service life, greatly reducing the frequency of cutting edge grinding and maintenance.

3.Application Of IC Semiconductor Packaging Mold

drawing die, wear-resistant parts, drawing die with high compression ratio, upsetting piercing and stamping tools under large stress, punching and shearing workers, dies and large impact shaping and stamping dies.

4.IC Semiconductor Packaging Mold Details

5.Product Qualification

Dongguan Jingdu Cemented Carbide Products Co., Ltd. has a complete and scientific quality management system, with strong strength, excellent service, professional metallurgical experience, complete supporting facilities; and a number of proficient sales personnel and technically experienced Operators, strict quality management system and scientific and rigorous management mechanism, I believe that what you get in Kyoto is not only the guarantee of material quality, but also the professional services we provide you at work.

6.FAQ

Q: Can you design and process products according to our size?

A: Yes, we can customize the processing according to the product drawings or samples you need.

Q: Are you a trading company or a manufacturer?

Answer: We have our own processing factory, which directly sells the goods of the factory, customizes suitable products for customers, saves costs and shortens the distance between the factory and the buyer.

Q:Can I only buy some spare parts from you?

A:Yes.

Q:Will you attend the fair to show your IC Semiconductor Packaging Mold?

A:Yes.

Q:How many staffs do you have in your factory?

A:There are 25 employees

Q:Do you have any agent in our country?

A:NO

Q:Do you have any real project pictures of the equipment?

A:Yes, you can contact us if you need.

Q:How far is your factory from the city hotel?

A:About ten minutes.

Q:How far is your factory from the airport?

A:About an hour.

Q:How long it will take from Guangzhou to your factory?

A:About two hours.

Q:Where is your factory located?

A:Dongguan, Guangdong, China

Q:Do you provide free spare parts, such us IC Semiconductor Packaging Mold?

A:Free

Q:Do you provide sample? Free or charge?

A:Yes, the samples are free

Q:What is your term of payment?

A:30 days.

Q:What is your MOQ?

A:MOQ is 10.

Q:Are you a trading company or a manufacturer?

A:We are a manufacturer.

Q:How long is your delivery time?

A:7 days.